Copperclad FR4 PCB Substrates
- Fully annealed electrolytic copper foil (Grade 3 HTE)
- Available cladding:
- half-ounce: 0.00065 in. (0.017mm)
- one-ounce: 0.0013 in. (0.033mm)
- Substrate: modified tetra-functional epoxy resin
- Tg = 140°C
- Thickness: 0.059 in. (1.50mm)
- Full specifications
| Description | Unit | Reviews | Part Number | Price | |
|---|---|---|---|---|---|
| .5/.5 (half-ounce) double-sided Cu clad (0.059 in.), 9" X 12" - 5 pack | 5 Pack | CC62-0912-055 |
$59.95 |
1.0/1.0 (one-ounce) double-sided Cuclad (0.059 in.), 9" X 12" | 5 Pack | CC62-0912-105 |
$59.95 |
.5/.5 (half-ounce) double-sided Cuclad (0.059 in.), 12" X 18" | 5 Pack | CC62-1218-055 |
$118.95 |
1.0/1.0 (one-ounce) double-sided Cuclad (0.059 in.), 12" X 18" | 5 Pack | CC62-1218-105 |
$118.95 |