Think & Tinker, Ltd.
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Copperclad FR4 PCB Substrates

  • Fully annealed electrolytic copper foil (Grade 3 HTE)
    • Available cladding:
      • half-ounce: 0.00065 in. (0.017mm)
      • one-ounce: 0.0013 in. (0.033mm)
  • Substrate: modified tetra-functional epoxy resin
    • Tg = 140°C
    • Thickness: 0.059 in. (1.50mm)
  • Full specifications

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